An interposer and a method of manufacturing a flexible radio frequency (RF) type device having an IC and thin film circuits, such as an antenna. The device is made by using an easy-to-insert interposer subassembly with pre-positioned ICs to mechanically and electrically attach an IC to the thin film circuit. A method of mass producing radio frequency devices comprising antennas and ICs on interposers that are physically and electrically connected to the antennas using a pressure sensitive adhesive.