A novel method for order processing, manufacturing and distributing integrated circuits (ICs) including the steps of: dry packing a plurality of programmable ICs and placing the dry packed programmable ICs into inventory such that the inventory is re-accessible in an automated manner. A plurality of configuration programs are stored and in response to orders from customers, a subset of the inventoried ICs are unpacked in order to process the order. The process then includes the steps of programming the unpacked ICs with a configuration selected by the customer and re-packing the programmed ICs for shipment.