In a surface acoustic wave device according to the present invention, a transmitting filter element TX and a receiving filter element RX are formed on one main surface of a piezoelectric substrate 300, and are mounted by face down on an upper surface of a circuit board 200. A ground electrode 322 in the receiving filter element RX is connected to three linear via conductors 221' formed on the circuit board 200, and a ground electrode 312 in the transmitting filter element TX is connected to a crank-shaped via conductor 211' formed on the circuit board 200.

 
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> Semiconductor package having non-ceramic based window frame

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