Embodiments of the present invention are directed to a pallet assembly
which facilitates direct cooling of the wafer carrier. In one embodiment,
the pallet assembly comprises a frame which holds at least one carrier of
a component. The pallet assembly further comprises a tray which is
operable for being mechanically coupled with the frame. The tray
comprises at least one discreet region which corresponds with the carrier
when the tray is coupled with the frame. In embodiments of the present
invention, the discreet region comprises at least one hole extending
through the tray for permitting a coolant medium to dissipate heat from
the carrier.