A heat dissipation device for dissipating heat from an electronic device comprises a base, a heat dissipation member provided with two heat-dissipating plate groups intercrossed with each other and defining a plurality of air passages. At least a heat pipe connects the base with the heat dissipation member to transfer heat from the base to the heat dissipation member. A first heat sink and a second heat sink respectively contact with lateral sides of the heat dissipation member. The heat pipe is partly sandwiched between the heat dissipation member and the first and second heat sinks.