A polishing-condition predicting apparatus determines optimum parameters to be substituted into various function models by performing calibration by use of a TEG. A polishing condition enabling polishing of a thin film formed on a substrate to be designed so as to obtain a desirable height of the thin film and a desirable depth of a groove is predicted by simulation using the determined optimum parameters.

 
Web www.patentalert.com

> Simulating topography of a conductive material in a semiconductor wafer

~ 00387