A semiconductor package mainly includes a leadframe and a first
semiconductor chip such as an application specific integrated circuit
(ASIC) encapsulated in a first package body having a cavity for receiving
a second semiconductor chip such as a pressure sensor chip, and a cover
disposed over the cavity of the first package body. At least a portion of
the first package body is formed between the second semiconductor chip
and the die pad such that the second semiconductor chip is directly
disposed on the portion of the first package body instead of the die pad.