A nozzle useful for enhancing localized cooling of electronic elements and
the like is provided. The nozzle is mountable on a substantially planar
face of a substrate. It is conformed to intercept a fluid flowing across
said face and redirect it toward the substrate. The nozzle comprises a
hood, an output window, and between them, a transition region. The
transition region is conformed to turn the flowing fluid toward the
substrate and to contract the fluid flow.