A wafer-level package and an IC module assembly method for a wafer-level package are provided in the present invention. The method comprises forming a metal bump on a wafer, applying a high polymer resin coating to the wafer, grinding a surface of the resin coating, printing an endpoint on the wafer, a grinding and cutting step and bonding the chips to an antenna or substrate with SMT. The present invention can be used to manufacture high quality chips of low cost with mass production to significantly reduce cost and maintain high quality of the products.