A communication module is provided with a Transmit/Receive (T/R) element fabricated from psuedomorphic HEMT, High Electron Mobility Transistor technology (PHEMT). The T/R element drives multiple Radio Frequency MEMS switch-based phasing elements. Each of the phasing elements connects to a corresponding radiation element. A large quantity of the communication elements can be placed on a single substrate chip so as to provide for a reliable and cost effective device.