A semiconductor package and method for forming the same is disclosed herein. The semiconductor package includes a package support member, a pair of optoelectronic devices spaced from each other and coupled to the package support member, and an optically transmissive portion for separately encapsulating the pair of optoelectronic devices. A pair of lenses is formed as a unibody structure with the optically transmissive portion. The semiconductor package also includes an optically opaque portion, which extends between and around the separately encapsulated devices to optically isolate encapsulated optical devices. The optically opaque portion also extends outward from portions of the encapsulated devices, thereby forming a pair of fiber optic receptacles as a unibody structure with the optically opaque portion. By forming lensing elements and fiber optic receptacles in such a manner, the present method provides an easier and more accurate means by which to passively align optical conductors to underlying encapsulated optical devices.