A chassis includes a plurality of slots to receive modules. The chassis includes an electrical backplane to couple to a module received in a first slot of the plurality of slots. The module to couple via a first communication interface on the module. An optical backplane is also included in the chassis. The optical backplane is to couple to the modules via a second communication interface on the module. The optical backplane is to couple to the second interface on the module via at least one interconnect through an opening in the electrical backplane. The interconnect configured to couple a fabric interface associated with the second communication interface to a communication channel routed over the optical backplane.