A printed circuit board is provided with first lands, second lands, and third lands. The first lands are arranged so as to correspond to first bumps arranged along a first side of an integrated circuit device when the integrated circuit device is mounted on the printed circuit board. The first lands are used to output electrical signals individually. The second lands are less in number than the first lands, and arranged so as to correspond to second bumps arranged along a second side of the integrated circuit device opposite to the first side. The second lands have an area the same as that of the first lands, and are used to input electrical signals individually. The third lands are arranged so as to correspond to third bumps arranged in a row formed by the second bumps, have an area larger than that of the first lands, and are not used to input or output electrical signals.