A circuit board assembly with a substrate having a laminate construction
of ceramic layers, such as an LTCC ceramic substrate. The substrate is
configured for the purpose of improving the thermal management of power
circuit devices mounted to the substrate. Thermally-conductive vias
extend through the substrate from a first surface thereof to a second
surface thereof. A circuit device is mounted to the first surface of the
substrate and is electrically interconnected to conductor lines of the
substrate. The device is also thermally coupled to the
thermally-conductive vias with a first solder material. A heat sink
located adjacent the second surface of the substrate is bonded to the
thermally-conductive vias with a second solder material, such that the
first solder material, the thermally-conductive vias, and the second
solder material define a thermal path from the device to the heat sink.