A heat sink retention apparatus includes a base member and a heat sink mount including a pivotal base coupler and a board mounting member, whereby the heat sink mount is operable to mount to a board by engaging the pivotal base coupler with the base member and engaging the board mounting member with the board. A cable routing member and a connector storage member may be included on the heat sink mount for the routing of cables and the storing of connectors. A card retention device may be provided which is operable to couple to the heat sink mount and engage a card to retain the card on the board.