A clear and ductile thermoplastic molding composition containing (i) a styrene copolymer and (ii) a rubber component is disclosed. The styrene copolymer is represented by styrene-acrylonitrile copolymer and the rubber component is a styrene-butadiene-styrene (SBS) block copolymer. Characterized by its low haze, high light transmission, good processability and mechanical properties the composition is suitable for making a variety of useful articles.