An IC package includes a package body of non-conductive material. A conductive heat-sink pad includes an interior pad portion located within an interior of the package body. An exterior pad portion is located external to the package body. The exterior pad portion includes at least two pad pieces that are spaced apart to define at least one channel that separates the at least two pad pieces, the at least two pad pieces being electrically connected with each other. The at least two pad pieces may be flush with an underside surface of the package body or one or more of the pad pieces may extend outwardly from the package body.