An electronic equipment assembly includes a shelf having a front section configured to support a front set of circuit boards and a rear section configured to support a rear set of circuit boards. The electronic equipment assembly further includes a midplane disposed within the shelf between the front section and the rear section. The midplane is configured to directly connect to the front set of circuit boards and to the rear set of circuit boards. The electronic equipment assembly further includes a fan subsystem disposed within the shelf. The fan subsystem is configured to generate an air stream through the front and rear sections with air flow of the air stream being faster through the front section past the front set of circuit boards relative to the rear section past the rear set of circuit boards.