A light emitting device comprises a light emitting element, a metal package having a recess part for housing the light emitting element and a base part which has one or more through holes, and one or more lead electrode pins which penetrate the through holes and are separated from the through holes by an insulating member respectively. The bottom faces of the lead electrode pins project out from the bottom face of the base part and are positioned on a same plane including an outer bottom face of the recess part. With this configuration, the light emitting device has a good heat radiating characteristic and high mechanical strength.