Cosmetic compositions for topical use for protecting the skin and the hair, containing, in a cosmetically acceptable support, at least one compound of formula (1) or (2) ##STR00001## in which X.sub.1 represents R.sub.3--(C.dbd.O)--, R.sub.3--SO.sub.2-- or R.sub.3--O--(C.dbd.O)--, X.sub.2 represents --(C.dbd.O)--R'.sub.3--(C.dbd.O), --SO.sub.2--R'.sub.3--SO.sub.2-- or --(C.dbd.O)--O--R'.sub.3--O--(C.dbd.O)--, Y represents --(C.dbd.O)--R.sub.4 or --SO.sub.2R.sub.5, R.sub.2 represents a C.sub.1-8 alkyl group, n is 0, 1 or 2, R.sub.3 represents C.sub.1-30 alkyl or C.sub.3-30 alkenyl, R'.sub.3 represents a single bond or a divalent C.sub.1-30 alkylene or C.sub.3-30 alkenylene radical, R.sub.4 represents --OR.sub.6 or --NHR.sub.6, R.sub.5 represents C.sub.1-30 alkyl or a phenyl nucleus, R.sub.6 represents C.sub.1-30 alkyl or C.sub.3-30 alkenyl, and novel compounds of formula (2).

 
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> Lead-free solder, and connection lead and electrical component using said lead-free solder

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