A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2 2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.