The present invention relates to a surface protecting adhesive film for a semiconductor wafer in which an adhesive layer having a storage elastic modulus from 1.times.10.sup.5 Pa to 1.times.10.sup.7 Pa at 150.degree. C. and a thickness of from 3 .mu.m to 100 .mu.m is formed on both a surface and back surface of a base film having a melting point of at least 200.degree. C. and a thickness of 10 .mu.m to 200 .mu.m. According to the present invention, in a step of grinding the back side of a semiconductor wafer and removing a damaged layer generated on the back side, the semiconductor wafer can be prevented from being broken and being contaminated and the like even if a semiconductor wafer is thinned as low as 100 .mu.m.