A twin-substrate wireless electronic module includes a main substrate, a plurality of integrated circuit chips, a frame substrate, a filter, and a shield member. The main substrate has a first surface and a second surface, and is formed with a notch that extends from the first surface through the second surface. The integrated circuit chips are surface-mounted on the first and second surfaces of the main substrate. One of the integrated circuit chips disposed on the first surface is a transceiver integrated circuit chip. The frame substrate has a first frame surface and a second frame surface. The first frame surface has a filter-mounting area aligned with the notch. The filter is surface-mounted on the filter-mounting area and is accommodated in the notch. A method for manufacturing the twin-substrate wireless electronic module is also disclosed.