A heat sink is arranged on a main circuit board of an electronic module.
The heat sink includes a three-dimensionally structured thermally
conductive plate with a press-on region and with snap-action hooks. The
snap-action hooks are arranged approximately at right angles with respect
to the press-on region and are resiliently connected to the press-on
region. The snap-action hooks are latched into place, with pressure
generation of the press-on region onto a rear side of a surface-mountable
semiconductor device, into corresponding passage openings of the circuit
board. A plastically deformable thermal composition is disposed between
the rear side of the semiconductor device and the press-on region of the
heat sink so as to form an intermediate layer therebetween to provide
compensation for the thickness tolerances of the semiconductor device.