A lead is connected to an integrated circuit in an implantable medical
device in a lead bonding region that includes a lead-receiving recessed
region. At least a portion of a lead conductor is bonded in the
lead-receiving recessed region, making an electrical and mechanical
connection to the integrated circuit that is strong and potentially
biostable. In some embodiments, a filler material is provided around the
recessed portion of the integrated circuit that receives the lead
conductor, and a metal coating is provided around an outer surface of the
filler material for additional mechanical stability.