An LED lamp according to the present invention includes: a substrate 10 having a principal surface 10a; at least one LED 12, which is supported on the principal surface 10a of the substrate 10; a reflector 16, which has an opening that defines a reflective surface 14 surrounding the side surface of the LED 12 and which is supported on the principal surface 10a of the substrate 10; and an encapsulating resin layer 18, which covers the LED 12 and the reflector 16 together. When a portion of the encapsulating resin layer 18 that covers the side surfaces 16w of the reflector 16 has a thickness Dw and another portion of the encapsulating resin layer 18 that covers the upper surface 16h of the reflector 16 has a thickness Dh, the LED lamp has a Dh/Dw ratio of 1.2 to 1.8.

 
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> Process for manufacturing a through insulated interconnection in a body of semiconductor material

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