A miniaturized fan module can be accommodated in an electronic system (such as a server) to provide heat dissipation. The miniaturized fan module has a smaller structural size than that of a conventional fan module, such that a larger bump-preventing buffer space between the miniaturized fan module and a framework of the server is provided for preventing the fan module from bumping against the server framework due to vibration generated in practical operation, without degrading a heat dissipating effect and structural strength of the fan module.