The present invention describes a process for manufacture of RFID tags. The RFID tag of the present invention includes a substrate, an antenna, and a die positioning structure disposed on the substrate that is cast and cured specifically for receiving a silicon die of the type typically used in RFID applications. The substrate is selected from a number of materials, the properties of which render it penetrable by electron beam radiation. The die positioning structure is a second material which is electron beam curable, and which is deposited and cured at high speed on the substrate in a novel fashion in accordance with the present invention in a highly efficient, reproducible and economical manner.