According to various embodiments, exemplary interconnects and methods for interconnection are provided that can include contacts formed by fiber bundles. The exemplary interconnects can be used to form separable or non-separable electro-mechanical connections between one or more of the generally accepted six levels of interconnection. In various embodiments, the exemplary interconnects can allow management of the thermal properties of the electronic devices. Exemplary interconnects can also provided reduced thickness allowing redundancy and additional compliance as desired.