The metal foil-clad laminate of the present invention comprises at least one polyimide layer made of a polyimide having repeating units represented by the following formula I: ##STR00001## wherein R and .PHI. are as defined in the specification, at least one insulating substrate, and at least one metal foil layer. The polyimide is excellent in thermopress-bonding property, solubility in solvents and heat resistance, and exhibits a low dielectric constant. The metal foil-clad laminate having the polyimide layer is suitably applicable to high-frequency printed wiring boards, etc.