An airflow guide structure and manufacture thereof is used to allow
components of an airflow guide are cut by molds in a factory to form thin
plates in each of which has a plurality of bendable lines, and
transported into a mainframe assembly plant to store therein. Each
component of the airflow guide is folded into a three-dimensional type at
a production line when a mainframe wants to be assembled. Because each
component of the airflow guide is a thin plate and lighter in weight, it
can be stacked together with another component before a three-dimensional
cover body is assembled. Therefore, the space is saved and the
transportation and storage are more convenient.