In a semiconductor module, twenty five semiconductor devices having light receiving properties, for example, are arranged in five by five matrices using a conductor mechanism formed from six lead frames Each column of semiconductor devices is connected in series and each row of semiconductor devices is connected in parallel. These are embedded in a light transmitting member formed from a transparent synthetic resin, and a positive electrode terminal and a negative electrode terminal are disposed. The semiconductor devices are formed with first and second flat surfaces, and negative electrodes and positive electrodes are disposed.