Techniques for producing integrated capacitors are disclosed. According to
one of the techniques, one or more layers are introduced in conjunction
with a ground layer supporting a substrate on which various components
are realized. Depending on the use of an integrated capacitor, micro
capacitors can be formed between one introduced layer and the ground
layer or between two introduced layers. As all micro capacitors are
connected in parallel, an integrated capacitor with usable capacitance is
thus produced without occupying an extra space that would otherwise
increase the size of the silicon chip. In addition, with proper
connections, an interdigitated capacitor can be formed as well.