The invention relates to a radiation curable composition comprising relative to the total weight of the composition (A) 0 29 wt % of a cationically curable component having a linking aliphatic ester group, (B) 10 85 wt % of an epoxygroup containing component other than A, (C) 1 50 wt % of an oxetanegroup containing component, (D) 1 25 wt % of a multifunctional acrylate and a radical photoinitiator and a cationic photoinitiator.

 
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> Hardware/software platform for rapid prototyping of code compression technologies

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