An array of electrostatically tiltable mirrors are formed in a MEMS structure. A first SOI wafer is etched to form an array of tiltable plates in the silicon device layer joined to the remainder of the wafer through pairs of torsion beams. A second SOI wafer is etched to form cavities corresponding to the tiltable plates. A ceramic multi-chip module (MCM) carrier is formed with multiple layers of wiring and electrodes corresponding to the tiltable plates. The two SOI wafers including their handle layers are bonded together. The handle layer of the second SOI is removed, and the bonded wafers are diced into chips. Each chip is bonded to a respective MCM carrier. Thereafter, the handle layer of the first SOI wafer is removed to release the tiltable mirror plates and the torsion beams. Electronic control chips may be bonded to the MCM carrier.