A method of testing and an embedded probe-enabling socket are provided for implementing debug and testing functions. The socket includes an integral probe structure enabling Top Side of the Module (TSM) signal probing. The socket includes a substrate with a topside including a plurality of probe pads. A TSM socket frame includes a plurality of probe pins electrically connecting to respective probe pads on the substrate topside. The probe pins are electrically connected with a respective signal to be monitored.