A thin metallic sheet having an array of alternating domes, directed away
from opposite sides of the sheet, to bridge a gap between a top surface
of a processor package and a bottom surface of a heat sink. The sheet is
positioned between the processor package and heat sink before securing
the heat sink to the processor package. By pressing the processor package
and heat sink together, the tops of the domes flatten out to maximize
surface contact between a first side of the sheet and the top of the
processor package, and between a second side of the sheet and the top of
the heat sink.