A CMP slurry is provided comprising polishing particles, the polishing
particle comprising organically modified colloidal silica. Also, a method
of preparing a CMP slurry is provided, comprising the steps of: preparing
polishing particles comprising organically modified silica; converting
the polishing particles into an aqueous state; and adding pure water, a
hydrophilic additive and a dispersing agent to the polishing particles.
The polishing particles can be synthesized using a sol-gel process.
According to the invention, a slurry having excellent polishing
properties can be prepared, in which the surface properties of colloidal
silica are changed to control the physical properties of the polishing
particles and which can ensure a desired CMP removal rate while
minimizing the occurrence of scratches.