In both-side recording, wherein the fed recording sheet is conveyed to the recording portion and after the recording is executed on a face side surface, the recording sheet is conveyed to a sheet reversing portion where both sides are reversed, and is sent to the recording portion again where the rear side surface is recorded, a clearance between the recording head and the recording sheet can be changed when recording on the face side or the rear side surface. A first clearance suitable for the recording sheet having a standard thickness and material, and a second clearance greater than the first clearance, can be selected. When there is a possibility that the recording head can come into contact with the recording sheet due to influences from warping and the like, the second clearance is selected, and when there is less possibility of contact, a first clearance is selected.

 
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> Method of forming a high-k film on a semiconductor device

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