A method for encapsulating an assembly with a methyl phenyl silicone rubber compound is provided. In various embodiments, the method can include exposing the assembly to a solvent, plasma etching the assembly, and producing a potting mixture, wherein the potting mixture comprises a methyl phenyl room temperature vulcanization silicone and a curing agent. The method can further include pouring the potting mixture over the assembly while under a vacuum until the assembly is encapsulated, pouring at least two control samples of the potting mixture while under the vacuum, curing the encapsulated assembly and the control samples in a first environment and monitoring the one of the control samples for hardness, and determining whether additional cure time in the first environment is needed based upon the results of the control sample hardness tests.