The present invention is directed to a method for an electrically conductive structure on a printed circuit board for connecting an element on the printed circuit board with other elements. The electrically conductive structure may include a contact pad on a first side of the printed circuit board and two or more connection pads on the first side of the printed circuit board. The two or more connection pads are in close physical proximity to the contact pad and electrically connected to the contact pad. The element on the printed circuit board is directly connected to one the two or more connection pads electrically. The structure permits various engineering changes to the electrical connections of elements on the printed circuit board by desoldering electrical connections to the two or more connection pad, by severing traces to the connection pads, or by severing the electrical connection between the connection pads and the contact pad.