An improved hinge for a micro-mirror device composed of a conductive doped
semiconductor and immune to plastic deformation at typical to extreme
temperatures. The hinge is directly connected to the micro-mirror device
and facilitates the manufacturing of an optically flat micro-mirror. This
eliminates Fraunhofer diffraction due to recesses on the reflective
surface of the micro-mirror. In addition, the hinge is hidden from
incoming light thus improving contrast and fill-factor.