A semiconductor component having electrode terminals 14 formed in
rectangular planar shapes arranged in parallel on an electrode forming
surface of a semiconductor chip and formed with rerouting patterns 16
electrically connected with the electrode terminals 14 through vias on
the surface of an electrical insulating layer covering the electrode
forming surface, characterized in that the planar arrangement of the via
pads 20 formed on the surface of the electrical insulating layer is made
an arrangement alternately offset to one side and the other side of the
longitudinal direction of the electrode terminals 14 and in that
rerouting patterns 16 are provided connected to the via pads 20. The
present invention enables easy formation of rerouting patterns even when
the electrode terminals are arranged at fine intervals.