An interlayer connector for preventing delamination of semiconductor
layers, and methods of forming the connector are disclosed. The connector
includes a first connector head in a first distal layer, a second
connector head in a second distal layer and a connector body coupling the
first and second connector heads. Each connector head has a dimension
greater is size than the connector body such that the layers are securely
held together. The interlayer connector may be isolated from
current-carrying wiring or provided in the form of a contact via. The
interlayer connector provides a mechanical mechanism to prevent layers
from delaminating regardless of the materials used. The invention also
eliminates the need for white space fill above and below via fill by
using the connectors coplanar with the on device wiring.