The present invention provides a semiconductor device having a structure
that can be mounted on a wiring substrate, as for the semiconductor
device formed over a thin film-thickness substrate, a film-shaped
substrate, or a sheet-like substrate. In addition, the present invention
provides a method for manufacturing a semiconductor device that is
capable of raising a reliability of mounting on a wiring substrate. One
feature of the present invention is to bond a semiconductor element
formed on a substrate having isolation to a member that a conductive film
is formed via a medium having an anisotropic conductivity.