A fiber optic module that includes a packaged integrated circuit chip
mounted on a top surface of a printed circuit or other mounting board is
disclosed. The integrated circuit chip is electrically coupled to an
optical subassembly (OSA) mounted along an edge of the printed circuit
board and capable of emitting or receiving light traveling parallel to
the printed circuit board. The packaged IC chip is electrically coupled
to the OSA through at least one microwave via extending through the board
and a conductive trace formed on the opposed bottom surface of the board.