A heat-dissipating module comprises a conductive part, a fan and a
flow-guiding shield. The conductive part has a receiving plane being
connected to the fan and fits with the flow-guiding shield. The fan has a
fan wheel with a circular area measured with the diameter thereof greater
than the receiving plane so that the fan wheel extends outward the
receiving plane. The flow-guiding shield provides an inlet and an outlet
and at least a guiding part is disposed at the inlet side. The guiding
part receives fluid from the fan and the outlet fits with the conductive
part. The fluid dragged by the fan wheel is received by and guided with
the guiding part toward the conductive part.