Polyimide/metal laminates having a polyimide film and a metal layer
laminated thereon, wherein the polyimide film contains titanium element
and flexible print wiring boards with the use of the same are disclosed.
The polyimide/metal laminates are excellent in adhesion under the
ordinary conditions and, moreover, can sustain the adhesive strength at a
high ratio after exposure to high temperature or high temperature and
high humidity. Owing to these characteristics, these polyimide/metal
laminates are appropriately usable in flexible print wiring boards,
multi-layered print wiring boards, rigid flex wiring boards, tapes for
TAP, semiconductor packages such as CFOs and multi chip modules (MCMs),
magnetic recording films, coating films for aerospace materials and filmy
resistance elements.