A surface acoustic wave device includes: interdigital transducers; first electrode pads that are connected to the interdigital transducers through wire patterns; and a piezoelectric substrate on which the interdigital transducers, the first electrode pads, and the wire patterns, are formed. In this surface acoustic wave device, at least one of the first electrode pads is not connected to a ground pattern, and the piezoelectric substrate has a conductivity in the range of 10.sup.-12/.OMEGA.cm to 10.sup.-6/.OMEGA.cm.

 
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> Surface acoustic wave arrangement with a junction region between surface acoustic wave structures having a decreasing then increasing finger period

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