A flip-chip package includes a packaging substrate; an integrated circuit die affixed to the packaging substrate, wherein the integrated circuit die includes an active integrated circuit surrounded by a peripheral die seal ring therein; and a thermal stress releasing pad disposed in a stress-releasing area that is at a corner of the integrated circuit die outside the die seal ring, wherein the thermal stress releasing pad is connected to the packaging substrate by using a solder bump, which, in turn, is connected to a dummy heat-spreading metal plate embedded in the packaging substrate so as to form a heat shunting path for reducing thermal stress during temperature cycling test.